The InfiniteFocus® is an optical 3D measurement device for research and quality assurance in the micro- and nano range. It provides all functionalities for 2D and 3D dimensional measurements, surface analysis and characterization. Geometries with steep flanks, different reflective properties and strong roughness are measured with a vertical resolution up to 10 nm, making the instrument ideal for surface study of both homogeneous and compound materials. 3D Measurements are performed directly in the optical image. Its operating principle combines the depth of focus of an optical system with vertical scanning to provide topographical and color information from the variation of focus. Novel and unique algorithms reconstruct this into a single 3D data set with accurate topographical information. Traceable calibration standards allow the verification of measurement results. The instrument can be used in both the laboratory and on-line applications in production, it can be operated by semi skilled technicians where required. Automation of functions and analysis can be added to make the instrument useable for the majority of surface metrology and inspection requirements.

The Edgemaster® is an optical 3D measurement device for research and quality assurance in the micro- and nano range. It provides all functionalities for 2D and 3D dimensional measurements, surface analysis and characterization. The profiler is used for traceable and repeatable measurement of radii, clearance, chip, cutting angle comparative form measurement of basket arch to reference geometry, tolerance measurement of chipping and verification of wear and symmetry. Its operating principle combines the depth of focus of an optical system with vertical scanning to provide topographical and color information from the variation of focus. Novel and unique algorithms reconstruct this into a single 3D data set with accurate topographical information. The instrument can be used in laboratory and production, it can be operated by semi skilled technicians where required.

The new neox can be used for standard bright-field color microscopy imaging, confocal imaging, 3D confocal profiling, PSI, VSI and high resolution thin film thickness measurements. In addition to its compact and robust design, the neox is a complete tool that is ideal for obtaining a fast, non-invasive assessment of the micro- and nano-geometry of technical surfaces in multiple configurations; from standard setup for R&D and quality inspection laboratories to sophisticated, customized solutions for online process control. 

The Sensofar’s PLu 4300 is an optical profiler for the 3D measurement of surfaces and thin films. The unique combination of Interferometrical optical profiling and Spectroscopic Reflectometry on the same sensorhead makes the PLμ 4300 the only system in the market able to measure 3D profiles, roughness and thickness of opaque and transparent materials with sub-nanometer resolution. The optically integrated Spectroscopic Reflectometer opens an unprecedented combination of an optical profiler and thin film measurement technology on a single instrument. In real world, White Light interferometry is limited to measure thicknesses thicker than 500 nm. In contrast, Spectroscopic Reflectometer is able to measure thicknesses from 10 nm with 0.1 nm of resolution in a tenth of a second.

The PLu 1300 is a portable Optical Imaging Profiler capable of measuring 3D information of technical surfaces with the use of Interferometric and Confocal technologies. The sensor has been designed to have all optical components sealed in order to operate in production environments, where dust and particles are all over. With a total weight less than 4.5 kg and up to 5 meter long single cable, the operator handles the sensor safely and places it onto the surface under inspection. By a single start/stop button the surface topography is measured, analyzed and reported. By default PLu 1300 comes with interferential technology which is able to achieve the highest axial resolution (down to 0.1 nm in PSI mode), and up to 400 µm scanning range for VSI. Extended PSI keeps the PSI resolution with increased vertical scanning range. Confocal technology can be added optionally to measure higher local slopes and rough surfaces.

For the first time in microscopy, real time, non-invasive 3D measurements with nanometric resolution can be measured with a revolutionary technology called "Digital Holographic Microscopy" (DHM™). The characteristics of DHM™ instruments make out of it a unique solution for following the whole development cycle of a product, from innovative R&D to quality control in production line, passing through the quantitative optimization of the manufacturing process.

The DHM R2200 family performs measurements at two wavelengths simultaneously. Its innovating optical schema is composed of two nested DHM with common object path and camera and holds three light sources. This unique feature, offered by DHMs' principle, provides a dual wavelength real-time measurement mode with two synthetic wavelengths that allows an increase of the measurement range to step heights of up to 15 µm, without any scanning or wavelength switch.