The semiconductor industry is evolving rapidly to meet the growing demands for higher performance, greater efficiency, and more compact designs. As traditional scaling faces physical and economic limitations, innovative approaches like heterogeneous integration and advanced packaging have emerged as essential solutions. These technologies are revolutionizing the way components are integrated into systems, enabling the combination of diverse functionalities and the optimization of interconnectivity within compact, high-performance packages.
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Please click on ‘Request Application Note’ and download the application note ‘Advanced packaging and heterogeneous integration; Optical metrology solutions for next-generation semiconductors’.