These techniques are used to deposit thin layers of material on a solid surface. All processes are operated at pressures well below the atmospheric pressure. Vacuum deposition includes small scale R&D to pilot scale production systems for thin film deposition of Physical Vapour Deposition (PVD) , Chemical Vapour Deposition (CVD) and Atomic Layer Deposition (ALD). There are multiple techniques like e-beam, magnetron sputtering, and low- & high temperature thermal evaporation.
Physical Vapour Deposition
EVAPORATION & MAGNETRON SPUTTERING
♦ MiniLab 026 | Compact floor standing vacuum evaporator
♦ MiniLab 060 | Multiple source magnetron sputtering system
♦ MiniLab 080 | High aspect ratio PVD system
♦ MiniLab 090 | Glovebox-compatible PVD system
♦ MiniLab 125 | High volume PVD system
♦ nanoPVD-S10A | Compact benchtop high-performance, for RF and DC magnetron sputtering
♦ nanoPVD-T15A | Compact benchtop high-performance, for thermal- and low temperature evaporation
♦ nanoPVD-ST15A | Compact benchtop high-performance, for thermal evaporation and magnetron sputtering
♦ nanoEM | Coating tool with a full research-grade feature set
Atomic Layer Deposition
LAB- & COMMERCIAL-SCALE ALD SOLUTIONS
♦ Prometheus | Advanced R&D System for Powders
♦ Athena | R&D Scale Object Coating
♦ Apollo | High Throughput Rapid Wafer Coating
Chemical Vapour Deposition
GRAPHENE & CARBON NANOTUBES
♦ nanoCVD-8G | For graphene
♦ nanoCVD-WPG | For graphene, wafer-scale, plasma-enhanced
♦ nanoCVD-8N | For carbon nanotubes
