Vacuum Deposition


These techniques are used to deposit thin layers of material on a solid surface. All processes are operated at pressures well below the atmospheric pressure. Vacuum deposition includes small scale R&D to pilot scale production systems for thin film deposition of Physical Vapor Deposition (PVD) , Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD). There are multiple techniques like e-beam, magnetron sputtering, and low- & high temperature thermal evaporation.

Physical Vapor Deposition

EVAPORATION & MAGNETRON SPUTTERING

♦   MiniLab 026 | Compact floor standing vacuum evaporator

♦   MiniLab 060 | Multiple source magnetron sputtering system

♦   MiniLab 080 | High aspect ratio PVD system

♦   MiniLab 090 | Glovebox-compatible PVD system

♦   MiniLab 125 | High volume PVD system

♦   nanoPVD-S10A | Compact benchtop high-performance, for RF and DC magnetron sputtering

♦   nanoPVD-T15A | Compact benchtop high-performance, for thermal- and low temperature evaporation

♦   nanoPVD-ST15A | Compact benchtop high-performance, for thermal evaporation and magnetron sputtering

♦   nanoEM | Coating tool with a full research-grade feature set

Chemical Vapor Deposition

GRAPHENE & CARBON NANOTUBES

chemical vapor deposition

♦   nanoCVD-8G | For graphene

♦   nanoCVD-WPG | For graphene, wafer-scale, plasma-enhanced

♦   nanoCVD-8N | For carbon nanotubes

Atomic Layer Deposition

LAB- & COMMERCIAL-SCALE ALD SOLUTIONS

Atomic Layer Deposition

♦   Prometheus | Advanced R&D System for Powders

♦   Athena | R&D Scale Object Coating

♦   Apollo | High Throughput Rapid Wafer Coating

Soft Etching and Thermal Processing

SUBSTRATE & DEVICE PREPARATION

soft plasma etching

 

♦    nanoETCH | Dedicated soft-etching instruments

♦    ANNEAL | Thermal treatment of 2D materials