THEIA – R&D scale wafer coating

The Forge Nano Theia system is the only R&D tool for ALD that delivers ultra fast deposition, compatible with large-scale production. THEIA delivers ultra fast deposition with Forge Nano’s patented SMFD-ALD™, in a low cost system for R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration  of applications requiring thick films. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with aspect ratios up to 1,000.


ICON-key-features-greyKey Features and Benefits

♦   Field- upgradeable and scalable 

♦   Better then 1% non-uniformity across wafer

♦   Ultra fast deposition (12-30 nm/min)                                                                                                                                                                                                                             

ICON-key-features-greyApplications

♦   Semiconductor (e.g. high k-dielectrics, metal-insulator-metal (MIM) film stacks, ultra-conformal SiO2 for trench isolation, ALD-Cap for chip passivation)

♦   Device fabrication

♦   Flat panel displays, glass and optics

About Forge Nano

Global leaders in surface engineering and precision nano-coating technology, using Atomic Layer Deposition. Forge Nano’s proprietary technology and manufacturing processes make angstrom-thick coatings fast, affordable and commercially viable for a wide range of materials, applications and industries.

Why Forge Nano?

♦  Tools purpose built for performance, efficiency and throughput

♦  From lab scale to commercial scale

♦  In-house R&D department for system optimization

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