The NX-Wafer is a low noise, high throughput atomic force profiler with automatic defect review. Through high resolution 3D imaging, the system is able to classify defect types and source their origin. Because of the True Non-Contact™ mode tips have a longer lifetime and samples occur less damage. This feature also allows you to make precise and reproducible sub-Angstrom roughness measurements for the flattest substrates and wafers with minimized tip-to-tip variation.


ICON-key-features-greyKey Features and Benefits

♦   Most advanced defect review solution, smart ADR

♦   Atomic Force Profiler for CMP measurements

♦   High-throughput Wafer-Fab Inspection and Analysis


♦   ADR on 300mm bare wafers

♦   Chemical Mechanical Polishing (CMP) metrology with advanced AFM surface profiler

♦   Surface roughness measurement of media and substrate

About Park Systems

Playing a critical role in the development of AFM technology, Park Systems has remained the leading innovator in nanoscale microscopy and metrology throughout its long history and continues to invest in the development of new emerging technologies. With headquarters in Korea, the US, Japan, Singapore and Europe, they create some of the world’s most accurate and most effective AFMs for research and industry.

Why Park Systems?

♦   World-recognized leader in the AFM industry

♦   Unmatched ease of use

♦   The most innovative AFM technology

Product icon oranjeRelated products



Fully automated AFM for overhang profiles, high-resolution sidewall imaging and critical angle measurements


Fully Automated Multi-Technique Scanning XPS/HAXPES Microprobe