Groot-Ammers | May 13th, 2025

While the semiconductor industry continues to push the limits of device performance and miniaturization, 3D metrology remains essential for achieving consistent yield, reliable quality, and faster time-to-market.

In this webinar, discover how 3D optical metrology meets the challenges posed by both front-end and back-end semiconductor manufacturing. You’ll learn about cutting-edge automation for in-line inspection, best practices for advanced packaging and heterogeneous integration evaluation, and real-world applications from wafer-level testing to final device verification.

Join us to see how Sensofar’s metrology solutions can help keep you ahead in the rapidly evolving semiconductor landscape.

DATE & TIME
Wednesday, May 28th, 2025
10:00 – 10:45 (CEST) 

Key topics:

• Critical role of 3D metrology for semiconductor manufacturing
• Leveraging Automation for High-Volume/High-Yield Environments
• Tackling next-gen chips: advanced packaging and heterogeneous integration
• Real-world Applications Across the Semiconductor Supply Chain